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XC4062XLA-09BG560I

XC4062XLA-09BG560I资料
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File Size : 116 KB Manufacturer:XILINX Description:State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) Support Unregulated Battery Operation Down to 2.7 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25C Ioff and Power-Up 3-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs

	1PCS	100PCS	1K	10K
价格


型号：XC4062XLA-09BG560I 厂家：XILINX 封装：42 批号：01+ 数量：BGA 说明：


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