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XC3S1000-4FG456C

XC3S1000-4FG456C资料
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File Size : 116 KB Manufacturer:XILINX Description:During the switch between active and standby condi- tions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the out- put capacitance loading of the device. At a minimum, a 0.1mF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and VPP to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM ar- rays, a 4.7mF bulk electrolytic capacitor should be used between VCC and VPP for each eight devices. The lo- cation of the capacitor should be close to where the power supply is connected to the array.

	1PCS	100PCS	1K	10K
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型号：XC3S1000-4FG456C 厂家：XILINX 封装：360 批号：05+ 数量：BGA 说明：


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