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| XC3030-70PQ100C资料 | |
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XC3030-70PQ100C PDF Download |
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File Size : 116 KB
Manufacturer:XILINX Description:The ThinPakTM Package is a perforated, metalized ceramic substrate attached to the silicon using 302oC solder. An epoxy underfill is applied to protect the high voltage termination from debris. All exterior metal surfaces are tinned with 63pb/37sn solder providing the user with a circuit ready part. It's small size and low profile make it extremely attractive to high dI/dt applications where stray series inductance must be kept to a minimum. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：XC3030-70PQ100C 厂 家：XILINX 封 装：14 批 号：N/A 数 量：QFP100 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
