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| XC2VP20-5FG676I资料 | |
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XC2VP20-5FG676I PDF Download |
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File Size : 116 KB
Manufacturer:XILINX Description:The UCSP is a unique package that greatly reduces board space compared to other packages. UCSP relia- bility is integrally linked to the users assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering using a UCSP. This form factor might not perform equally to a packaged product through traditional mechanical reliability tests. Performance through operating life test and moisture resistance remains uncompromised, as it is determined primarily by the wafer-fabrication process. |
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| 相关型号 | |
| ◆ XC68HC912D60VPV8 | |
| ◆ XC68HC912D60MFU8 | |
| ◆ XC68HC912D60CPV8 | |
| ◆ XC68HC912D60CFU8 | |
| ◆ XC68HC912BD32CFU | |
| ◆ XC68HC912B32VFU8 | |
| ◆ XC68HC912B32MFU8 | |
| ◆ XC68HC912B32CFU8 | |
| ◆ XC68HC705B32CFN | |
| ◆ XC56303VF100 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：XC2VP20-5FG676I 厂 家：XILINX 封 装：50 批 号：05+ 数 量：BGA 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
