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| XC2S300E-FG456资料 | |
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XC2S300E-FG456 PDF Download |
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File Size : 116 KB
Manufacturer:XILINX Description:Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Evaluation Board Evaluation Board |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：XC2S300E-FG456 厂 家：XILINX 封 装：610 批 号：06+ 数 量：BGA 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
