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| TEA2025资料 | |
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TEA2025 PDF Download |
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File Size : 116 KB
Manufacturer:ST Description:(1) Lead Forming When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Do not use the base of the leadframe as a fulcrum during lead forming. Lead forming should be done before soldering. Do not apply any bending stress to the base of the lead. The stress to the base may damage the characteristics or it may break the LEDs. When mounting the LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TEA2025 厂 家：ST 封 装：DIP16 批 号： 数 量：10k 说 明：DIP16 |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
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