 |
|||||||
|
|||||||
|
|
|||||||
|
|||||||
|
|
| TDA4856资料 | |
|
TDA4856 PDF Download |
|
File Size : 116 KB
Manufacturer:PHI Description:Overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the PCB (Printed Circuit Board). This minimizes ground inductance and improves ground continuity. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/oC |
|
| 相关型号 | |
| ◆ XC68HC912D60VPV8 | |
| ◆ XC68HC912D60MFU8 | |
| ◆ XC68HC912D60CPV8 | |
| ◆ XC68HC912D60CFU8 | |
| ◆ XC68HC912BD32CFU | |
| ◆ XC68HC912B32VFU8 | |
| ◆ XC68HC912B32MFU8 | |
| ◆ XC68HC912B32CFU8 | |
| ◆ XC68HC705B32CFN | |
| ◆ XC56303VF100 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
|
型 号：TDA4856 厂 家：PHI 封 装：06+ 批 号：3k 数 量：DIP-M32P 说 明： |
|||||
|
运 费： 所在地： 新旧程度： |
|||||
| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
建议使用分辨率:1024*768