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| RFT3100资料 | |
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RFT3100 PDF Download |
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File Size : 116 KB
Manufacturer: Description:The figure below shows a lump model of the thermal properties of the size 4 thinPak packaged VCS, from the 2-mil solder on the top of the lid on the left to the 2-mil solder on the bottom of the device on the right. By adding the user's lump model of the rest of the thermal system the user can calculate the junction and case temperature rise under any operating condition. |
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| 相关型号 | |
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| ◆ XC68HC912D60CPV8 | |
| ◆ XC68HC912D60CFU8 | |
| ◆ XC68HC912BD32CFU | |
| ◆ XC68HC912B32VFU8 | |
| ◆ XC68HC912B32MFU8 | |
| ◆ XC68HC912B32CFU8 | |
| ◆ XC68HC705B32CFN | |
| ◆ XC56303VF100 | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：RFT3100 厂 家： 封 装： 批 号：100 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
建议使用分辨率:1024*768