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| PCA9504ADGG资料 | |
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PCA9504ADGG PDF Download |
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File Size : 116 KB
Manufacturer:PHILIPS Description:Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of solder profiles recom- mended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：PCA9504ADGG 厂 家：PHILIPS 封 装：196 批 号：03+ 数 量：SSOP-56 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
建议使用分辨率:1024*768