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| MFRC50001T资料 | |
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MFRC50001T PDF Download |
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File Size : 116 KB
Manufacturer:PHILIPS Description: The 300C/W for the SOTC23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 416 milliwatts. There are other alternatives to achieving higher power dissipation from the SOTC23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad™. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MFRC50001T 厂 家：PHILIPS 封 装： 批 号：700 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
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