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MAX3238ECAI

MAX3238ECAI资料
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File Size : 116 KB Manufacturer:MAXIM Description: Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The THS3201 may incorporate a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. (3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. (4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device.

	1PCS	100PCS	1K	10K
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型号：MAX3238ECAI 厂家：MAXIM 封装：2500 批号：06+ 数量：SOP28 说明：


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