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| MAX3233ECWP资料 | |
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MAX3233ECWP PDF Download |
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File Size : 116 KB
Manufacturer:MAXIM Description:The Smart 3 Advanced Boot Block, manufactured on Intels latest 0.25 µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intels WWW page: http://www.intel.com/design/flash. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MAX3233ECWP 厂 家：MAXIM 封 装：2500 批 号：06+ 数 量：SOP20 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
