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HCS301-SN

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File Size : 116 KB Manufacturer:MICROCHIP Description:The new Smart 3 Advanced Boot Block, manufactured on Intels latest 0.4µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective, monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide products will be available in 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intels WWW page: http://www.intel.com/design/flcomp.

	1PCS	100PCS	1K	10K
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型号：HCS301-SN 厂家：MICROCHIP 封装：SOP8 批号：数量：138 说明：SOP8


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