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| GAL16V8D-25LP资料 | |
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GAL16V8D-25LP PDF Download |
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File Size : 116 KB
Manufacturer:LATTICE Description:These chips, when properly assembled, display characteristics similar to the TLV2352. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip can be mounted with conductive epoxy or a gold-silicon preform. |
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| 相关型号 | |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：GAL16V8D-25LP 厂 家：LATTICE 封 装：209 批 号：05+ 数 量：DIP 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
