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| DS1669-10资料 | |
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DS1669-10 PDF Download |
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File Size : 116 KB
Manufacturer:DALLAS Description:The package consists of a gallium-arsenide infrared-emitting diode and an npn silicon phototransistor mounted on a 6-lead frame encapsulated within an electrically nonconductive plastic compound. The case can withstand soldering temperature with no deformation and device performance characteristics remain stable when operated in high-humidity conditions. Unit weight is approximately 0.52 grams. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：DS1669-10 厂 家：DALLAS 封 装：DIP8 批 号： 数 量：20 说 明：DIP8 |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
| 手 机： |
| QQ：371911117 |
| MSN：gjk8477@hotmail.com,jessica848377@yahoo.com.cn |
| 传 真：86-755 25621209 |
| EMail：kingrand_tek@163.com |
| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
建议使用分辨率:1024*768