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| BSM35GD120DN2资料 | |
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BSM35GD120DN2 PDF Download |
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File Size : 116 KB
Manufacturer:88 Description: For more information on the PWP package, refer to TI technical brief, literature number SLMA002. Test board conditions: 1. 3 x 3, 4 layers, thickness: 0.062 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the two internal layers 5. 12 thermal vias (see Recommended Land Pattern in applications section of this data sheet) (3) Maximum power dissipation may be limited by over current protection. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：BSM35GD120DN2 厂 家：88 封 装： 批 号： 数 量： 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：关女士 |
| 电 话：86-75584720945 |
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| 公司地址： Huaqiang Electronic World, Futian District, Shenzhen, China |
